5299E RTV 2 Thermally conductive 1:1 Silicone Potting Compound for Drive Power

Product manual

5299E is a low-viscosity two-component addition silicone potting compound with medium thermally conductive. It can be applied to the surface of PC, PP, ABS, PVC and other materials and metal materials.

Product feature

● Room temperature or heat accelerated cure
● No substance is released during curing
● Flexible and stable from -40 °C to 200 °C after cured
● Excellent electrical properties with high impedance and high dielectric strength
● Excellent anti-sedimentation design, suitable for long-distance transportation and long-term storage

Main purpose

● Suitable for general potting/encapsulant material of power supplies or other components thermal release
● Potting the power modules and electronic components to protect

Standards compliant

REACH
ROHS
UL

Technical parameters

Item		Part A	Part B	Standard
Uncured	Color	Grey,Black,White	White	Q/ZS 1-2016
	Viscosity(cps,25℃)	1500～3000	1500～2500	GB/T 10247
	Mixing ratio by weight	1∶1		Q/ZS 1-2016
	Viscosity after mixing(cps,25℃)	1500～3000		GB/T 10247
	Working Time(min，25℃)	30-50		Q/ZS 1-2016
	Curing time(hr，25℃)	3-5		GB/T 531.2
Cured	Hardness(shore A)	40-50		GB/T 531.2
	Thermal conductivity[W/(m·K)]	≧0.6		ASTM D5470
	Dielectric strength(KV/mm)	≧18		GB/T 1695
	Dielectric constant(1.0MHz)	2.4~3.0		GB/T 1694
	Volume Resistivity(Ω·cm)	≧1.0×10¹³		GB/T 1692
	Specific Gravity (g/cm³)	1.56±0.02		GB/T 13354
	UL 94 Flame Classification	UL94 V0		UL 94
	Coefficient of thermal expansion (ppm/℃)	220		HGT 2625-1994

Use restrictions

Reasons for poor curing of addition silicone potting compound:
1.Contact materials: When in contact with the following ingredients, it will affect the surface curing. The slight one will only cure incompletely on the surface, and the heavy one will cause permanent or even incomplete curing:
● Release agent, such as detergent;
● Plasticizers, such as certain plasticizers in insulating plastics, wires and protective coils;
● Substances containing nitrogen, phosphorus, sulfur and halogen, such as natural rubber and neoprene;
● Soldering flux, such as rosin;
● Organometallic (lead, tin, mercury, etc.);
● Amine-containing substances, such as polyurethane and epoxy resin
● Condensation silicone sealant or potting compound

2.Environment: When using, avoid residual oil in the container or the object being used; avoid some impurities falling into it;avoid contact with some commonly used plasticizer plastic and
rubber glove; whether the vacuum equipment or oven has used (at the same time) epoxy resin, polyurethane, condensation silicone products.
3.Operational aspects: The mixing ratio is not carried out in accordance with the technical parameters; because some products have not been used for a long time, there is some sedimentation, and each component is not fully stirred before use.

ZS-GF-5299E丨RTV Two-Part 0.6 W/m·K Thermal Conductivity Silicone Potting Compound